The Inquirer has a few pictures of a test board for the new LGA1366 version of the Nehalem processor and it looks like Intel has made a fair few changes to how the CPU and the cooler will be mounted to motherboards. First of all, it appears as if the CPU retention mechanism is now attached to a metal plate at the back of the motherboard to prevent board warping.

Sadly, it seems like Intel decided to keep the push-pin cooler design, although it also appears like the mounting holes for the CPU cooler are much wider apart than on LGA775 sockets. The size of the LGA1366 CPU socket with the new retention mechanism fitted measures 60x82mm, compared to 58x61mm for current LGA775 processors.

This means that you can forget about using your current CPU cooler and this should make the cooler manufacturers happy, as they get to sell a bunch of new coolers to everyone that upgrades to the new platform.

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