A few hours ago, EVGA released the X58 SLI LE (141-BL-E757-TR), its third Core i7-based motherboard to hit the market since November.
Two weeks ago we covered most of the superficial details of this board, including the fact that it will be placed directly under and priced lower than the current X58 SLI (141-BL-E758). One of the more notable features is the fact that it has four PCI-Express 2.0 slots that run at x16--x16 in standard SLI, x8/x8/x16/ in SLI with PhysX or x8/x8/x8/x8 in Tri-SLI with PhysX, similar to the X58 SLI Classified (E760) non-NF200 model. It also features a 6-phase analog PWM design with a single EPS 12v connector.
New information from the EVGA product page suggests that the board is capable of running up DDR3 1600MHz+ on its six triple-channel slots. The heatsink design has also been updated since the last images we received.
Old heatsink design:
Final retail heatsink design:
The EVGA X58 SLI LE is currently available for $239.99 but only from EVGA at the moment. Retail channels are expected to have them in stock very soon.