Published in Mobiles

IBM uses Power6 design for telephones


Silicon on Insulator


IBM is to use the silicon-on-insulator (SOI) technology that is usually reserved for server processors in mobile phones.

According to LinuxWorld the new chips will be a 30 percent improvement on standard CMOS technology. By building it on a scale of 45-nanometer feature sizes, IBM will achieve higher performance than comparable 65nm chips.

The Cu-45HP (high performance) custom chip will be released in early 2008. As well as mobiles it will be put in switches and routers. It will also have 45-nm embedded DRAM (dynamic RAM) architecture instead of SRAM (static RAM) in the chip.

More here.

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