Featured Articles

AMD Never Settle Forever bundle hits 200-series cards

AMD Never Settle Forever bundle hits 200-series cards

AMD’s Never Settle bundles have been around for a while and the community response has been extremely positive. When AMD launched…

More...
AMD shipping Beema APUs

AMD shipping Beema APUs

According to Lisa Su, SVP & GM, Global Business Units at AMD, Beema notebook parts have started shipping to manufacturers last…

More...
IHS teardown reveals Galaxy S5 BOM

IHS teardown reveals Galaxy S5 BOM

Research firm IHS got hold of Samsung’s new flagship smartphone and took it apart to the last bolt to figure out…

More...
Galaxy S5, HTC One M8 available selling well

Galaxy S5, HTC One M8 available selling well

Samsung’s Galaxy S5 has finally gone on sale and it can be yours for €699, which is quite a lot of…

More...
KFA2 GTX 780 Ti Hall Of Fame reviewed

KFA2 GTX 780 Ti Hall Of Fame reviewed

KFA2 gained a lot of overclocking experience with the GTX 780 Hall of Fame (HOF), which we had a chance to…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Tuesday, 15 June 2010 11:41

Samsung and GlobalFoundries release development platform

Written by Nick Farell

ImageImage

They want a low power chip for mobiles


Samsung
and GlobalFoundries have announced a development platform that could speed up the development of a new generation of low-power chips for mobile gear.

The outfits say that the development platform will lead to faster design and production of mobile and embedded chips using the advanced 32-nanometer and 28-nanometer processes.

In the kit are tools to help designing and engineer of chips. GlobalFoundaries thinks that it could help customers push more power-efficient mobile chips to market faster, said Jason Gorss, a GlobalFoundries spokesman.

The platform uses Arm IP and low-power process technology from the Common Platform, which is an alliance between IBM, Samsung and GlobalFoundries.

Samsung Electronics said it has completed reliability testing and is ready to start volume production of low-power chips using the 32-nanometer process.


Last modified on Tuesday, 15 June 2010 13:36
blog comments powered by Disqus

To be able to post comments please log-in with Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments