gotten their hands on some AMD roadmaps that are detailing AMD's notebook plans until 2011 and there are a few interesting nuggets on offer. Although the details are limited to mainstream notebooks and chipsets, it does seem like we've got a lot to look forward too.
This year we should see three new mobile chipsets, the RS880MC, RS880M and RX881, all part of the Tigris platform. Both of the RS880M chipsets will feature DirectX 10.1 IGP graphics, HyperTransport 3 and improved idle power. The RS880M also supports UVD 2 and external graphics, while the RX881 is a discrete solution with HyperTransport 3 support.
These chipsets will be paired up with the SB710 which adds support for 12 USB 2.0 ports and six SATA ports. The Tigris platform also consists of Caspian which is a new CPU based to a degree in the Puma platform. Caspian will offer up to two cores, DDR2 800MHz memory support and it's built on 45nm. Discrete graphics will come from a so far unspecified ATI M9x-series GPU.
In 2010 we can look forward to Danube with retains the three chipsets, but adds a new SB800-seris south bridge which adds another couple of USB 2.0 ports, 4 PCIe lanes and RAID. On the CPU side of things we can look forward to Champlain which will offer up to four cores and take advantage of DDR3 1,066MHz memory and it's again manufactured at 45nm.
In 2011 the Sabine platform will take over and it will be based on Llano which should be the first mobile CPU from AMD with an onboard GPU with integrated DirectX 11 graphics, UVD 3 and DDR3 1,600MHz memory support. Llano should be manufactured at 32nm and it will be available in both a socketed version and a BGA version for low TDP systems. At the same time the SB900-series south bridge will launch that adds an integrated DAC, USB 3.0 support (isn't this a bit late? Ed.) and an integrated clock gen. over the SB800.
If this roadmap is indeed right, then it seems like AMD might fall behind Intel yet again, as Intel should have CPUs with integrated graphics out next year. However, AMD is a generation behind on manufacturing technology and it makes sense that the company is waiting for its 32nm process to be ready before they attempt to put what is two rather hot running parts into the same packaging.
You can find more details here