Featured Articles

Nvidia officially launches the 8-inch Shield Tablet

Nvidia officially launches the 8-inch Shield Tablet

As expected and reported earlier, Nvidia has now officially announced its newest Shield device, the new 8-inch Shield Tablet. While the…

More...
Intel launches new mobile Haswell and Bay Trail parts

Intel launches new mobile Haswell and Bay Trail parts

Intel has introduced seven new Haswell mobile parts and four Bay Trail SoC chips, but most of them are merely clock…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
AMD SVP John Byrne named turnaround exec of the year

AMD SVP John Byrne named turnaround exec of the year

Director of AMD’s PR Chris Hook has tweeted and confirmed later in a conversation with Fudzilla that John Byrne, Senior Vice…

More...
AMD A8-7600 Kaveri APU reviewed

AMD A8-7600 Kaveri APU reviewed

Today we'll take a closer look at AMD's A8-7600 APU Kaveri APU, more specifically we'll examine the GPU performance you can…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 06 July 2011 10:05

TSMC might offer the first 3D chips

Written by Fudzilla staff


Beating Intel at its own game
Chipmaker for hire TSMC could deliver the world’s first 3D chips, thus beating industry heavyweight Intel at its own game.

A report by the Taiwan External Trade Development Council claims that TSMC’s projected delivery of 3D chips could match Intel. Mind you, Intel announced last May that it would start shipping its first 3D chips with tri-gate transistors by the end of the year.

However, TSMC will offer an entirely different technology with 3D interconnect, dubbed through silicon vias (TSV). It basically uses vertical connections that pass through various layers of die within the same package.

The upshot of both technologies is that it allows an increase in transistor density by up to 1,000 times and a power consumption reduction of up to 50 percent, but it will probably take a couple of years before we see 3D chips in every gadget.

More here.

 

Fudzilla staff

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments