Featured Articles

Analysts expect ARM to do well next year

Analysts expect ARM to do well next year

British chip designer ARM could cash in on the mobile industry's rush to transition to 64-bit operating systems and hardware.

More...
Huawei and Xiaomi outpace Lenovo, LG in smartphone market

Huawei and Xiaomi outpace Lenovo, LG in smartphone market

Samsung has lost smartphone market share, ending the quarter on a low note and Xiaomi appears to be the big winner.

More...
Intel Broadwell 15W coming to CES

Intel Broadwell 15W coming to CES

It looks like Intel will be showing off its 14nm processors, codenames Broadwell, in a couple of weeks at CES 2015.

More...
Gainward GTX 980 Phantom reviewed

Gainward GTX 980 Phantom reviewed

Today we’ll be taking a closer look at the recently introduced Gainward GTX 980 4GB with the company’s trademark Phantom cooler.

More...
Zotac ZBOX Sphere OI520 barebones vs Sphere Plus review

Zotac ZBOX Sphere OI520 barebones vs Sphere Plus review

Zotac has been in the nettop and mini-PC space for more than four years now and it has managed to carve…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 06 July 2011 10:05

TSMC might offer the first 3D chips

Written by Fudzilla staff


Beating Intel at its own game
Chipmaker for hire TSMC could deliver the world’s first 3D chips, thus beating industry heavyweight Intel at its own game.

A report by the Taiwan External Trade Development Council claims that TSMC’s projected delivery of 3D chips could match Intel. Mind you, Intel announced last May that it would start shipping its first 3D chips with tri-gate transistors by the end of the year.

However, TSMC will offer an entirely different technology with 3D interconnect, dubbed through silicon vias (TSV). It basically uses vertical connections that pass through various layers of die within the same package.

The upshot of both technologies is that it allows an increase in transistor density by up to 1,000 times and a power consumption reduction of up to 50 percent, but it will probably take a couple of years before we see 3D chips in every gadget.

More here.

 

Fudzilla staff

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments