Featured Articles

Intel releases tiny 3G cell modem

Intel releases tiny 3G cell modem

Intel has released a 3G cellular modem with an integrated power amplifier that fits into a 300 mm2 footprint, claiming it…

More...
Braswell 14nm Atom slips to Q2 15

Braswell 14nm Atom slips to Q2 15

It's not all rosy in the house of Intel. It seems that upcoming Atom out-of-order cores might be giving this semiconductor…

More...
TSMC 16nm wafers coming in Q1 2015

TSMC 16nm wafers coming in Q1 2015

TSMC will start producing 16nm wafers in the first quarter of 2015. Sometime in the second quarter production should ramp up…

More...
Skylake-S LGA is 35W to 95W TDP part

Skylake-S LGA is 35W to 95W TDP part

Skylake-S is the ‘tock’ of the Haswell architecture and despite being delayed from the original plan, this desktop part is scheduled…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 06 July 2011 10:05

TSMC might offer the first 3D chips

Written by Fudzilla staff


Beating Intel at its own game
Chipmaker for hire TSMC could deliver the world’s first 3D chips, thus beating industry heavyweight Intel at its own game.

A report by the Taiwan External Trade Development Council claims that TSMC’s projected delivery of 3D chips could match Intel. Mind you, Intel announced last May that it would start shipping its first 3D chips with tri-gate transistors by the end of the year.

However, TSMC will offer an entirely different technology with 3D interconnect, dubbed through silicon vias (TSV). It basically uses vertical connections that pass through various layers of die within the same package.

The upshot of both technologies is that it allows an increase in transistor density by up to 1,000 times and a power consumption reduction of up to 50 percent, but it will probably take a couple of years before we see 3D chips in every gadget.

More here.

 

Fudzilla staff

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments