Featured Articles

Intel releases tiny 3G cell modem

Intel releases tiny 3G cell modem

Intel has released a 3G cellular modem with an integrated power amplifier that fits into a 300 mm2 footprint, claiming it…

More...
Braswell 14nm Atom slips to Q2 15

Braswell 14nm Atom slips to Q2 15

It's not all rosy in the house of Intel. It seems that upcoming Atom out-of-order cores might be giving this semiconductor…

More...
TSMC 16nm wafers coming in Q1 2015

TSMC 16nm wafers coming in Q1 2015

TSMC will start producing 16nm wafers in the first quarter of 2015. Sometime in the second quarter production should ramp up…

More...
Skylake-S LGA is 35W to 95W TDP part

Skylake-S LGA is 35W to 95W TDP part

Skylake-S is the ‘tock’ of the Haswell architecture and despite being delayed from the original plan, this desktop part is scheduled…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Tuesday, 16 August 2011 08:16

AMD's Deccan platform detailed

Written by Slobodan Simic
amd

The 28nm Kirshna and Wichita parts
In case you've been wondering about AMD's 2012 Deccan platform we bear some good news as the guys from Donanimhaber.com managed to snatch some fresh slides dealing with Wichita and Krishna chips. With up to four Bobcat cores, lower TDPs, better DirectX 11 graphics part, and Yuba FCH for some SATA and USB 3.0 fun it is quite clear that these will bring quite an improvement over currently available Zacate and Ontario chips.

As noted, both Wichita and Krishna will be made on the new 28nm manufacturing process and currently AMD is promising up to 20 percent higher processing power, over 25 percent higher graphics performance and up to 30 percent higher compute performance. Both Wichita and Krishna are a part of Deccan platform and will use a new FT2 socket. Of course we are talking about SoC desing and 2012 Deccan platform will feature up to four Bobcat cores at a lower TDP.

Spec wise, the Deccan platform will feature up to 2MB of L2 cache, new APM Bi-Directional Turbo Core feature, support for DDR3-1600 memory (including ultra low voltage DDR3 memory), AMD's UVD3 engine with Secure Asset Management Unit (SAMU), enhanced multimedia support and Yuba FCH with support for USB 3.0 and most probably SATA 6Gbps.

According to the latest roadmaps and rumours, AMD plans to start the production of these 28nm Witchita and Krishna chips sometimes at the end of Q2 2012.

You can check out new slides here.

Last modified on Tuesday, 16 August 2011 09:20
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments