Featured Articles

TSMC: Volume production of 16nm FinFET in 2H 2015

TSMC: Volume production of 16nm FinFET in 2H 2015

TSMC has announced that it will begin volume production of 16nm FinFET products in the second half of 2015, in late…

More...
AMD misses earnings targets, announces layoffs

AMD misses earnings targets, announces layoffs

AMD has missed earnings targets and is planning a substantial job cuts. The company reported quarterly earnings yesterday and the street is…

More...
Did Google botch the Nexus 6 and Nexus 9?

Did Google botch the Nexus 6 and Nexus 9?

As expected, Google has finally released the eagerly awaited Nexus 6 phablet and its first 64-bit device, the Nexus 9 tablet.

More...
Gainward GTX 970 Phantom previewed

Gainward GTX 970 Phantom previewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
EVGA GTX 970 SC ACX 2.0 reviewed

EVGA GTX 970 SC ACX 2.0 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 28 September 2011 11:25

Intel, IBM and Globalfoundries build R&D hub

Written by Nick Farell
intel_logo_newglobalfoundries

Looking for things to come
Rival chipmakers Intel, IBM, and Globalfoundries are working together to invest in a $4.4 billion R&D hub in New York. The five-year investment will target New York State, which is already a major centre of chip research and development activity tied to Biggish Blue and Globalfoundries.

The first project will focus on making the next two generations of computer chips. This will be mostly controlled by IBM.

The second project is a joint effort by Intel, IBM, TSMC, Globalfoundries and Samsung, will focus on moving existing 300mm wafer manufacturing technology to more advanced 450mm tech. 450mm wafers yield roughly twice the number of chips as today's 300mm wafers, which lowers the cost of making future chips.


blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments