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Snapdragon 400 is Qualcomm’s SoC for watches, wearables

We wanted to learn a bit more about Qualcomm's plans for wearables and it turns out that the company believes its…

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Qualcomm sampling 20nm Snapdragon 810

Qualcomm sampling 20nm Snapdragon 810

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EVGA GTX 970 SC ACX 2.0 reviewed

EVGA GTX 970 SC ACX 2.0 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

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Nvidia GTX 980 reviewed

Nvidia GTX 980 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

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PowerColor TurboDuo R9 285 reviewed

PowerColor TurboDuo R9 285 reviewed

Today we will take a look at the PowerColor TurboDuo Radeon R9 285. The card is based on AMD’s new…

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Wednesday, 28 September 2011 11:25

Intel, IBM and Globalfoundries build R&D hub

Written by Nick Farell
intel_logo_newglobalfoundries

Looking for things to come
Rival chipmakers Intel, IBM, and Globalfoundries are working together to invest in a $4.4 billion R&D hub in New York. The five-year investment will target New York State, which is already a major centre of chip research and development activity tied to Biggish Blue and Globalfoundries.

The first project will focus on making the next two generations of computer chips. This will be mostly controlled by IBM.

The second project is a joint effort by Intel, IBM, TSMC, Globalfoundries and Samsung, will focus on moving existing 300mm wafer manufacturing technology to more advanced 450mm tech. 450mm wafers yield roughly twice the number of chips as today's 300mm wafers, which lowers the cost of making future chips.


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