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45nm yields at GlobalFoundries have improved


28nm on schedule for production in 2011

, AMD’s foundry spin-off venture GlobalFoundries held a press event at Computex in which future expansion and business outlook strategies were held as the center of discussion. Tom Sonderman, the foundry's vice president of manufacturing systems and technology commented that one of the primary goals of the new spin-off is to race and beat Intel to achieving sub-45nm fabrication processes.

It appears that GlobalFoundries is actually holding to its word as it has recently claimed an achievement of mature 45nm process yields, and it intends to migrate all production at Fab 1 to 40/45nm processes by the end of 2009. The spin-off is also scheduled to launch its new Fab 2 facility in New York this July, where it expects to ramp up 28nm production right on schedule.

During the press event, the company demonstrated a wafer with AMD “Istanbul” six-core CPUs designed on 45nm Silicon-on-Insulator (SOI) process technology. It also showed off a 32nm SOI wafer for products scheduled in the second half of 2010, and even low power 28nm bulk DRAM wafers for use with wireless networks and handheld devices. These are scheduled to begin early risk production in the second half of 2010.

As TSMC struggles to pull its head out of the sand with 40nm yield issues affecting some of its high rolling larger customers, it looks like GlobalFoundries is attracting some industry attention with its timely production schedule of 45nm and sub-45nm fabrications.

On another note, TweakTown has video coverage of the wafer technologies that can be viewed here.

Last modified on 05 June 2009
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