GlobalFoundries tech helps sort out spectrum mess
DARPA is crediting Glo-Flo's 32 nm silicon-on-insulator (SOI) technology for providing the breakthrough it needed to sort out the mess over scarce electromagnetic (EM) spectrum.
Sooner than expected
While AMD recently announced its fourth generation GCN architecture, known as Polaris, at the CES 2016, it was keeping quiet on a launch date.
Greenland in 2016 claims ETNews
Korean ETNews believes that AMD will start manufacturing high-end Greenland GPUs in Samsung factories in the second quarter of 2016.
Abu Dhabi plans to off-load the company
AMD spin-off Globalfoundries might be off-loaded by its Abu Dhabi owners to the Chinese.
Pretty sure it is talking about Zen
AMD said that Globalfoundaries has demonstrated silicon success on the first AMD products using GloFlo’s 14nm FinFET process technology.
Slimming down with Ultra-Thin Body processes
Chinese foundries are ignoring FinFET technology and are developing Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production.
Six percent growth in a flat market
The overall semiconductor market is going to be flat or slightly down this year, but the foundry market is forecast to grow 6.1 per cent.
FinFETs and SOI working in different environments
Soitec's CEO and board chairman has raised an eyebrow or two when he said that the iPhone 6s has multiple RF chips built on silicon-on-insulator (SOI) substrates and that Intel and IBM are using the tech for their silicon photonics push.
More rumours – this time from the Orient
We wrote a story a while back claiming that GloFlo was going to develop its own 7nm 10nm free from the licencing constraints of its partner Samsung. This was greeted by much mirth at the time, but it is looking like we were right.