Expansion in the works
TSMC appears to be planning another huge chip exansion and written cheques to the value of $700 million on semiconductor capital equipment in recent weeks.
All ready for 2016
TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.
TSMC has asked the Investment Commission of Taiwan's Ministry of Economic Affairs to allow it to invest in a wholly-owned 12-inch wafer manufacturing facility and a design service centre in Nanjing, China.
Low production capacity
The dark satanic rumour mill has manufactured a hell on earth yarn that Intel will not be getting the work for LG’s Nuclun 2 because it lacks the production capacity.
Predicts it can make its cash elsewhere
Intel said 2016 sales will climb in the "mid single-digit" percent range and said it didn’t need a buoyant personal-computer market to make piles of dosh.
Ahead of Intel and TSMC
Samsung appears to have stolen a march on Intel and TSMC by coming up with a 10-nano FinFET processed S-RAM
Cortex A72 with 16nm TSMC FinFET
Huawei, the company that is probably the hardest to pronounce in tech has officially unveiled its Kirin 950 first FinFET 16nm based processor.
Foundries are asking LCD driver clients to upgrade to 12-inch process to provide a stable supply for analogue ICs, fingerprint sensors, MCUs, mixed-signal ICs, car-use chips, MEMS and other niche-market products.
Will add an Intel LTE-A modem
LG has been trying to make and launch a decent inhouse SoC. The first attempt was a limited success and now the company plans a successor – the LG Nuclun 2 to launch in 2016.