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Samsung releases 14nm Finfet wearable chip

by on11 October 2016


Exynos 7 Dual 7270

Samsung has begun mass production of the Exynos 7 Dual 7270 which is being billed as the “world’s first” mobile processor designed for wearable devices that is built on the 14-nanometer FinFET process technology.

Samsung has been using the 14nm technology since 2015 inside smartphones, but this is the first time it has been made for wearables. Samsung claims it is the first wearable processor to feature full connectivity and LTE modem integration.

Vice President of System LSI Marketing at Samsung, Ben Hur [no, really? ed] , said that the the chip uses Samsung’s state-of-the-art process technology:

“ It offers great power savings, 4G LTE modem and full connectivity solution integration, as well as innovative packaging technology optimized for wearable devices. It is a ground-breaking solution that will greatly accelerate wider adoption of wearable devices by overcoming limitations in current solutions such as energy usage and design flexibility,” he said.

 

The Exynos 7270 is powered by two Cortex-A53 cores. Samsung promises a 20 percent improvement in power efficiency when compared to its 28nm predecessor and notable extension in battery life. A Cat.4 LTE 2CA modem is integrated which will enable wearable devices to connect to cellular networks on their own. Wi-Fi and Bluetooth are also embedded alongside FM radio and location-based services with GNSS (global navigation satellite system).

Samsung’s system-in-package-embedded package-on-package technology, along with its excessive hyphen use, enables the Exynos 7270 to be compactly pushed into a small size ideal for wearables. The application processor, DRAM and NAND flash memory chips and the power management iC are all together in the same package.

Devices powered by Samsung’s new wearable device processor should appear early next year.

Last modified on 11 October 2016
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