According to various reports, AMD is planning to introduce a dual-core version of its Neo CPU later this year.
The new CPU should be a part of its upcoming Congo platform for thin
and light ultraportables. Along with the new CPU, Congo will reportedly
feature an
RS780M
chipset and SB710 southbridge, keeping the TDP within the 15W power
envelope of the recently announced Neo platform with a dual-core CPU.
Unlike Intel's Atom, Neo and Congo aren't designed for netbooks, but
rather affortable and light ultraportables, up to 14-inches. HP is the
first vendor to design a 12-inch notebook around AMD's Neo, but its
Pavilion DV won't be availeble till April.
Intel is also planning to launch a similar platform, based on its ULV dual-core architecture, sometime this year.
More
here.
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Intel's Neo killer CULV to show up in Q2