More than 80 per cent
The dark satanic rumour mill has manufactured a hell on earth yarn which claims that AMD’s 14nm manufacturing process has a yield of 80 percent.
Still coming in Q3 2017
While AMD is happily selling Ryzen 7 and Ryzen 5 CPUs and has announced the Ryzen Threadripper series, there is not much information about the Ryzen 3 lineup, other than it is expected to launch in Q3 2017.
Has Vega graphics inside
Jim Anderson, Senior Vice President and General Manager for Computing and Graphics Business Group at AMD, has announced the mobile Ryzen.
Up to 16 cores/32 threads with new HEDT platform
During its 2017 Financial Analyst Day, AMD has officially announced its new HEDT platform and Ryzen Threadripper. This CPU will "go beyond Ryzen 7" and target the world's fastest ultra-premium desktop systems.
For improved DDR4 memory support
AMD is apparently going to release a new Ryzen AGESA update for AM4 motherboards which should further improve memory support.
South Africa sales doing well
While AMD is a long way behind Intel in most past of the world now Ryzen is out it is starting to give Chipzilla a run for its money – at least in South Africa.
The new AMD Ryzen Balanced plan
AMD has released a new custom "balanced" power plan for those using Ryzen CPU on Windows 10 OS.
ASRock reveals some specifications
After launching the Ryzen 7 CPU lineup, AMD will launch its mainstream Ryzen 5 lineup in just under a week, but today we have additional information about an entry-level Ryzen 3 SKU, the Ryzen 3 1200.
Only for Ashes of the Singularity for now
AMD is apparently delivering on its promise that it will push developers to bring patches that will improve performance for its Ryzen CPUs and Oxide Games' Ashes of the Singularity is the first one to get it.
Two 8/6-core Ryzen dies stitched together
According to recent rumors, AMD could be preparing its response to Intel's high-end desktop (HEDT) lineup by launching 16- and 12-core desktop processors based on the same Ryzen CPU architecture but on a much larger socket, and according to fresh reports, these could be based on a multi-chip module design with two dies stitched together.