Altera deal might bite Chipzilla
Published in Processors
Thursday, 28 January 2016 12:19

Altera deal might bite Chipzilla


Analyst warns

Technology analyst Ashraf Eassa is getting a little worried about Intel’s $16.7 billion Altera deal which he thinks could end up being a huge flop.

Intel’s roadmap has three families on 10nm
Published in Processors


Rumours starting to firm up


It is starting to look like the rumours Chipzilla is planning to launch three processor families manufactured on the 10nm process node are proving true.

Samsung and TSMC slug it out over new processes
Published in Processors


Begun the Gen.3.14 FinFet wars have

Samsung and TSMC are starting to slug it out introducing Gen.3 14 and 16-nano FinFET system semiconductor processes, but the cost could mean that smartphone makers shy away from the technology in the short term.

TSMC's 5nm plans revealed
Published in Processors
Monday, 18 January 2016 11:27

TSMC's 5nm plans revealed


Two years after 7nm

Foundry TSMC claims it will be ready to roll out its 5nm process technology two years after the launch of its 7nm node..

TSMC does rather well
Published in News
Friday, 15 January 2016 11:20

TSMC does rather well


Will out perform the industry average

While many expected TSMC to suffer from from the downturn in China it appears that the company is still doing rather nicely thank-you.

Mother of Snapdragons choses Samsung
Published in Processors
Thursday, 14 January 2016 11:13

Mother of Snapdragons choses Samsung


Qualcomm knifes TSMC

Qualcomm's long running partnership with TSMC appears to be grinding to a halt after the chipmaker chose rival Samsung to make its coming flagship mobile chip.

TSMC buys more gear
Published in Processors
Wednesday, 23 December 2015 11:24

TSMC buys more gear


Expansion in the works

TSMC appears to be planning another huge chip exansion and written cheques to the value of $700 million on semiconductor capital equipment in recent weeks.

TSMC gets fan-out (InFO) wafer-level packaging
Published in Processors


All ready for 2016

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.

TSMC wants 12 inch wafer factory in China
Published in Processors
Monday, 07 December 2015 10:47

TSMC wants 12 inch wafer factory in China


16nm plans

TSMC has asked the Investment Commission of Taiwan's Ministry of Economic Affairs to allow it to invest in a wholly-owned 12-inch wafer manufacturing facility and a design service centre in Nanjing, China.

Intel loses LG’s Nuclun 2 to TSMC
Published in Processors
Thursday, 26 November 2015 14:21

Intel loses LG’s Nuclun 2 to TSMC


Low production capacity

The dark satanic rumour mill has manufactured a hell on earth yarn that Intel will not be getting the work for LG’s Nuclun 2 because it lacks the production capacity.