SVP and GM Mobile BU
A key member of the Qualcomm team in charge of the IoT, has started working at Micron. He got a saucy offer and left to Micron to be SVP and GM of Mobile Business Unit.
96-layer 3D-NAND flash plans
After Chipzilla and Micron have agreed to start seeing other people after finishing the development of 96-layer 3D-NAND flash, it is looking like Intel wants a hot Chinese partnership.
Rayfield runs the RTG, David Wang engineering
Before anyone jumps the gun claiming that Mike Rayfield, the newly promoted Senior Vice President and General Manager of AMD Radeon Technologies Group (RTG) is ex Micron, we wanted to point out that he used to run Tegra for Nvidia before. The man who will replace Raja Koduri’s engineering talents comes from ATI and Synaptics. David Wang is now Senior Vice President of Engineering at RTG.
Thanks for the memories
Intel and Micron are to pull the plug on their long-running partnership on 3D NAND flash memory by early next year.
The semiconductor man
Advanced Micro Devices has made the ex-CEO of Micron a director on its board.
Based on 3D MLC NAND
Crucial and its NAND partner Micron have unveiled its latest entry-level BX300 series SSD, which teams 3D MLC NAND in combination with a Silicon Motion SM2258 controller.
No-one caught the bus
Controversial chip designer Rambus is trying to sell itself off.
Expect more price hikes
A malfunction in a Taiwanese factory is causing a global DRAM shortage which could lead to further price increases.
Industry attempts to close global supply shortages
According to sources within the memory industry, global production of 3D NAND flash memory chips is expected to expand substantially in the second half of 2017, exceeding the output of 2D NAND chips by the fourth quarter of the year.