Published in
Cloud
26 November 2015
Samsung starts production on TSV DDR4
128GB DDR4 modules built
Samsung has started mass production of 128GB DDR4 modules built using 'through silicon via' (TSV) technology.
26 August 2010
Next-generation DDR4 SDRAM expected to reach 4.2GHz+ speeds
Incorporates new topology and 3D IC stacking techniques