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Bell sues Micron over layering process

by on29 April 2022

Hoping to make a ding in Micron profits

Bell Semiconductor has filed a patent infringement lawsuit against computer chipmaker Micron Technology which claims it nicked its layering process for fabricating semiconductor devices.

The lawsuit filed Wednesday in US District Court contends that Micron is using a process for making semiconductor devices developed and patented by Bell Semiconductor.

Bell Semiconductor is a technology and intellectual property licensing company so it is very interested in making people see that the tech it has bought is being used. It wants a jury trial, unspecified financial damages and a court order from the court barring Micron from using the process.

“Bell Semc is entitled to recover from Micron all damages that Bell Semi has sustained as a result of Micron’s infringement of the ʼ259 patent, including without limitation and/or not less than a reasonable royalty,” the lawsuit said.


Last modified on 29 April 2022
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