Belguim based boffins IMEC have teamed up with chip makers TSMC to build mixed-signal ICs as well as 3D, MEMS and BiCMOS products.

The pair have been working together for a while and now the plan is to formalise the arrangement. So far they have come up with a platform enabling development of product solutions using the so-called "More-than-Moore" technology options such as mixed-signal elements, 3D-technologies, MEMS processes, Si photonics and BiCMOS/HV.

They are hoping that they can capitalise on the growing demand for tiny electronic devices. According to a press release the pair use IMEC's expertise in R&D with TSMC's high-volume manufacturing. Punters can get access to emerging technologies, validate concepts at product level, and rapidly transfer to volume manufacturing.

As part of the prototyping process at IMEC, compatibility with existing TSMC processes will be pursued to ensure a smooth transition to volume manufacturing. The pair will now be looking at 22nm technology and use IMEC as TSMC's extended European research centre.