Last week, we
mentioned that Intel is readying to move its P55 desktop chipset to B3 stepping
early next month, with the change implemented primarily to support future Core
i5 and Core i7 processors on the LGA 1156 platform.
News has emerged from the company that it will also begin to
transition its PM55 mobile chipset to B3 stepping during the same timeframe as
its desktop counterpart. Intel’s PM55 chipset,
formerly known as Ibex Peak-M, is the refresh successor to the Montevina platform
and currently runs the Core i7 720QM 1.60GHz and Core i7 820QM 1.73GHz
processors respectively. The company has explained that the current B2 stepping
and upcoming B3 stepping are completely identical in physical size, fit,
electrical, mechanical and thermal specifications.
The primary reason for the update will be to support
upcoming 32nm processors, including dual-core Arrandale CPU + IGP packages. These chips are expected to launch in the first half of January
2010 and will be known as Core i5 520QM, Core i5 430M 2.26GHz, Core i3 350M 2.26GHz
and Core i3 330M 2.13GHz.
The B3 stepping itself includes new MM number and S-Spec
numbers and will require manufacturers to implement minor firmware and BIOS
updates. In particular, they will implement processor MRC and microcode updates
in order to enable support for these upcoming processors.
Intel will provide Intel PM55 B3 revision chipsets beginning
December 7th, and manufacturing partners will have until February 16th, 2010 to
prepare for the new revision.
Published in
PC Hardware
Intel PM55 mobile chipset moves to B3 stepping
Same timeframe as its desktop counterpart