With tempered glass panels, LED highlights and more
Cooler Master has announced its newest PC case that will be a part of its MasterCase series, the Maker 5T.
Fully integrated solution in Q1 2017
Nvidia has already announced that its integrated automotive solution won the hearts of Tesla and Volvo, while Qualcomm announced the Snapdragon 820A for automotive in early 2016. Now MediaTek has announced a plan to bring holistic, fully integrated system solutions to the automotive industry beginning in Q1 2017.
From the house of TSMC in 2017
The Kirin 960 is a 16nm SoC, that powered the Huawei Mate 9 and Mate 9 Pro, and is quite powerful, but it seems that Huawei plans a Kirin 970 SoC made using the 10nm FinFET manufacturing process and with obviously faster performance at lower energy consumption.
Since the day Xiaomi launched the Mi Mix phone with 91.3 percent screen-to-body ratio, people have wanted to get their hands on it. Now, it looks like Meizu might launch a phone with a front almost completely made of display or close to 100 percent screen-to-body ratio.
The Z270 SLI Plus and Z270 SLI
MSI has teased two upcoming motherboards that will be based on Intel's new Z270 Express chipset and bring certain new features and improvements, the MSI Z270 SLI Plus and the Z270 SLI.
Serious latency problems
One of the world’s most popular chipsets for gigabit broadband modems, Intel's Puma 6 chipset, suffers from at latency jitter so bad it ruins online gaming and other real-time connections.