Featured Articles

Broadwell to be faster than Skylake-S in desktop

Broadwell to be faster than Skylake-S in desktop

Intel will do something that it never did before. It will release two processor generations at once in the desktop space.…

More...
ARM’s signs off on 64 bit ARMv8-A

ARM’s signs off on 64 bit ARMv8-A

British chip designer ARM has just signed off its 50th licensing agreement for its ARMv8-A technology, which includes support for 64-bit…

More...
Intel Business vPro market divided into 7 categories

Intel Business vPro market divided into 7 categories

Just a few years ago we had two market segments for business users. We had desktops and notebooks and now Intel…

More...
GTA 5 will make November release

GTA 5 will make November release

While we have continued to hear that Grand Theft Auto V for the Xbox One, PlayStation 4, and PC will not…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 08 December 2010 12:19

Samsung announces 3D chip stacking

Written by Nick Farell


We like our memory dense, like Christmas pudding
Chipmaker Samsung has announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other.

The big idea is that the density of the memory by 50 per cent compared to conventional DIMM. It is all based on Samsung's Green DDR3 DRAM and 40 nanometer (nm)-sized technology.

In a press release the outfit told us that it will be aimed at the server and enterprise storage markets. Samsung said the process saves up to 40 per cent of the power consumed by a conventional RDIMM. Using the technology will greatly improve chip density in next-generation server systems, Samsung said.

The technology creates micron-sized holes through the chip silicon vertically instead of just horizontally.  This makes the architecture dense. Samsung wants to apply the same technology to  memory built with 30nm-class and smaller circuitry.

Samsung did not release any suggested pricing for the new RDIMM product, which will start to appear in the  second half of 2011.


Last modified on Wednesday, 08 December 2010 14:02
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments