Featured Articles

Intel releases tiny 3G cell modem

Intel releases tiny 3G cell modem

Intel has released a 3G cellular modem with an integrated power amplifier that fits into a 300 mm2 footprint, claiming it…

More...
Braswell 14nm Atom slips to Q2 15

Braswell 14nm Atom slips to Q2 15

It's not all rosy in the house of Intel. It seems that upcoming Atom out-of-order cores might be giving this semiconductor…

More...
TSMC 16nm wafers coming in Q1 2015

TSMC 16nm wafers coming in Q1 2015

TSMC will start producing 16nm wafers in the first quarter of 2015. Sometime in the second quarter production should ramp up…

More...
Skylake-S LGA is 35W to 95W TDP part

Skylake-S LGA is 35W to 95W TDP part

Skylake-S is the ‘tock’ of the Haswell architecture and despite being delayed from the original plan, this desktop part is scheduled…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 18 January 2012 15:14

Cooler Master announces Vertical Vapor Chamber tech

Written by Slobodan Simic

cm logo_mala

The future of air CPU coolers


During CES 2012, and now officially, Cooler Master showed off its Vertical Vapor Chamber technology that will be featured in upcoming CPU heatsinks. The new tech simply places two vapor chambers between the heatsink that improves heat transfer due to the larger contact area of vapor chamber thus enabling higher cooling performance at pretty much same or even lower noise level when compared to now already standard heatpipe coolers.

According to Cooler Master, the Vertical Vapor Chamber features less than half the air resistance by reducing airflow vortexes and noise generated by air straming through a heatsink. Thanks to the 3 time the fin contact area, you get faster and more efficient transfer of heat from the vapor chambers to the fins and more efficient use of the available fin surface area.

Cooler Master has noted that thanks to the Vertical Vapor Chamber, the new coolers should be able to deal with CPUs in excess of 200W with the same or lower noise level when compared to traditional coolers. The first product that will feature Vertical Vapor Chamber tech is the TPC-812 that should be officially released sometime around CeBIT where we will certainly get more details.

cm vvc_1

Last modified on Wednesday, 18 January 2012 19:52

Slobodan Simic

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments