has finally admitted that Ivy Bridge runs hotter than Sandy Bridge when overclocked. Now Intel is saying that it is simply using "a different package thermal technology" and that it is simply how the Ivy Bridge was designed to behave.
The "sort of" confirmation was snagged by The Inquirer, and according to Intel the shrink to the 22nm process node leads to higher temperatures due to increased thermal density and that "this is as designed and meets quality and reliability expectations for part operating under specified conditions".
Despite the recently unraveled usage of TIM paste instead of the fluxless solder under the IHS there has always been talk that most problems come from the 22nm process that has been the sole issue for the delay of the Ivy Bridge.
Since Intel is saying that this "is as designed", we honestly doubt that it will change anytime soon. The more OC friendly Ivy Bridge CPUs might come once the 22nm manufacturing process becomes more mature. When it comes to overclocking, it looks like that Sandy Bridge is still the way to go.
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