Published in Memory

Microsoft joins memory cube consortium

Resistance is futile

Microsoft has joined the Hybrid Memory Cube Consortium, set up by Micron and Samsung to develop 3D memory chip stacks.

The concept envisions a cube of stacked memory die, featuring a logic layer to optimize access to memory, which will potentially handle functions currently performed by memory controllers. Furthermore, the logic layer can be optimized and made to include new functions.

Microsoft believes cube memory represents a major step towards increasing memory bandwidth and performance, while cutting power consumption and latency. Micron hopes to deliver the first 2Gb and 4Gb cubes next year, with a bandwidth of 160Gbps.

More here.

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