Featured Articles

AMD sheds light on stacked DRAM APUs

AMD sheds light on stacked DRAM APUs

AMD is fast tracking stacked DRAM deployment and a new presentation leaked by the company  points to APUs with stacked DRAM,…

More...
Nvidia officially launches the 8-inch Shield Tablet

Nvidia officially launches the 8-inch Shield Tablet

As expected and reported earlier, Nvidia has now officially announced its newest Shield device, the new 8-inch Shield Tablet. While the…

More...
Intel launches new mobile Haswell and Bay Trail parts

Intel launches new mobile Haswell and Bay Trail parts

Intel has introduced seven new Haswell mobile parts and four Bay Trail SoC chips, but most of them are merely clock…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
AMD A8-7600 Kaveri APU reviewed

AMD A8-7600 Kaveri APU reviewed

Today we'll take a closer look at AMD's A8-7600 APU Kaveri APU, more specifically we'll examine the GPU performance you can…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 03 October 2012 09:33

What has Sony done inside the Super Slim PS3?

Written by David Stellmack

ps3 slim

Cost reduction not coming from die shrinks, it would appear

Everyone seems to want to know what is inside the new PlayStation 3 Super Slim, and the answer might surprise you. It would seem the stability of the current console comes because the company is using pretty much the same thing we saw in the last Slim PS3 unit.

Sony has elected to combine the Cell CPU and the RSX graphics core onto one chip, which is what Microsoft did in the latest 360 in order to achieve cost reductions while also improving the thermals over the previous generation of the Xbox 360.

While combining the two chips might sound like a good idea on the surface, it is a very complex process; and apparently Sony was not able to get it done for this round of cost reductions. The Super Slim PS3 uses the same Cell CPU and RSX. The chips would appear to be at 40nm. While it is scaled down, most of the hardware on the inside is unchanged from the Slim model.

It is clear that Sony has looked to other areas to save money, such as using cheaper plastics and doing away with the slot load Blu-ray drive. We suspect, however, that a move to 32nm (or maybe directly to 22nm?) is coming at some point for the Super Slim to be refreshed; this will help Sony squeeze more out of the console in order to drive the price even further down. Don’t look for it to happen soon, but it will happen at some point next year, we suspect.

blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments