Featured Articles

IHS teardown reveals Galaxy S5 BOM

IHS teardown reveals Galaxy S5 BOM

Research firm IHS got hold of Samsung’s new flagship smartphone and took it apart to the last bolt to figure out…

More...
Galaxy S5, HTC One M8 available selling well

Galaxy S5, HTC One M8 available selling well

Samsung’s Galaxy S5 has finally gone on sale and it can be yours for €699, which is quite a lot of…

More...
Intel lists Haswell refresh parts

Intel lists Haswell refresh parts

Intel has added a load of Haswell refresh parts to its official price list and there really aren’t any surprises to…

More...
Respawn confirms Titanfall DLC for May

Respawn confirms Titanfall DLC for May

During his appearance at PAX East panel and confirmed on Twitter, Titanfall developer Respawn confirmed that the first DLC pack for…

More...
KFA2 GTX 780 Ti Hall Of Fame reviewed

KFA2 GTX 780 Ti Hall Of Fame reviewed

KFA2 gained a lot of overclocking experience with the GTX 780 Hall of Fame (HOF), which we had a chance to…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Tuesday, 12 February 2013 10:59

Globalfoundries 10nm process slated for 2015

Written by Fudzilla staff

7nm parts by 2017

Globalfoundries seems unfazed by the PC slump and it plans to aggressively shift to new processes over the next few years.

By the end of the year Globalfoundries plans to start churning out 20nm LPM parts for wired applications and networking. In 2014 we should see the first hybrid 14nm XM (extreme mobility) parts, which combine 14nm FinFET transistors and 20nm back-end-of-line (BEOL). A 10nm hybrid process, utilizing 10nm FinFET with 14nm BEOL, is planned for 2015.

Globalfoundries is expected to roll out its 7nm process in 2017. However, high performance cores probably won’t reap the benefits of Glofo’s new processes anytime soon, so 32nm and 28nm parts aren’t going anywhere just yet.

Globalfoundries says it will be able to process around 190,000 300mm wafers per month by late 2013. However, TSMC can already process more than a million 300mm wafers a month.

More here.

blog comments powered by Disqus

To be able to post comments please log-in with Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments