Featured Articles

Hands on: Nvidia Shield Tablet with Android 5.0

Hands on: Nvidia Shield Tablet with Android 5.0

We broke the news of Nvidia's ambitious gaming tablet plans back in May and now the Shield tablet got a bit…

More...
Nokia N1 Android tablet ships in Q1 2015

Nokia N1 Android tablet ships in Q1 2015

Nokia has announced its first Android tablet and when we say Nokia, we don’t mean Microsoft. The Nokia N1 was designed…

More...
Marvell launches octa-core 64-bit PXA1936

Marvell launches octa-core 64-bit PXA1936

Marvell is better known for its storage controllers, but the company doesn’t want to give up on the smartphone and…

More...
TSMC 16nm FinFET Plus in risk production

TSMC 16nm FinFET Plus in risk production

TSMC’s next generation 16nm process has reached an important milestone – 16nm FinFET Plus (16FF+) is now in risk production.

More...
Nvidia GTX 970 SLI tested

Nvidia GTX 970 SLI tested

Nvidia recently released two new graphics cards based on its latest Maxwell GPU architecture, with exceptional performance-per-watt. The Geforce GTX 970…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Tuesday, 12 February 2013 10:59

Globalfoundries 10nm process slated for 2015

Written by Fudzilla staff

7nm parts by 2017

Globalfoundries seems unfazed by the PC slump and it plans to aggressively shift to new processes over the next few years.

By the end of the year Globalfoundries plans to start churning out 20nm LPM parts for wired applications and networking. In 2014 we should see the first hybrid 14nm XM (extreme mobility) parts, which combine 14nm FinFET transistors and 20nm back-end-of-line (BEOL). A 10nm hybrid process, utilizing 10nm FinFET with 14nm BEOL, is planned for 2015.

Globalfoundries is expected to roll out its 7nm process in 2017. However, high performance cores probably won’t reap the benefits of Glofo’s new processes anytime soon, so 32nm and 28nm parts aren’t going anywhere just yet.

Globalfoundries says it will be able to process around 190,000 300mm wafers per month by late 2013. However, TSMC can already process more than a million 300mm wafers a month.

More here.

blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments