Featured Articles

AMD sheds light on stacked DRAM APUs

AMD sheds light on stacked DRAM APUs

AMD is fast tracking stacked DRAM deployment and a new presentation leaked by the company  points to APUs with stacked DRAM,…

More...
Nvidia officially launches the 8-inch Shield Tablet

Nvidia officially launches the 8-inch Shield Tablet

As expected and reported earlier, Nvidia has now officially announced its newest Shield device, the new 8-inch Shield Tablet. While the…

More...
Intel launches new mobile Haswell and Bay Trail parts

Intel launches new mobile Haswell and Bay Trail parts

Intel has introduced seven new Haswell mobile parts and four Bay Trail SoC chips, but most of them are merely clock…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
AMD A8-7600 Kaveri APU reviewed

AMD A8-7600 Kaveri APU reviewed

Today we'll take a closer look at AMD's A8-7600 APU Kaveri APU, more specifically we'll examine the GPU performance you can…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Monday, 24 February 2014 14:31

Qualcomm rolls out 20nm LTE modem

Written by Fuad Abazovic



MWC 2014: Cat 6 300 Mbps

Qualcomm Executive Vice President Murthy Renduchintala has announced the first 20nm chip from Qualcomm. It is not a processor though - it’s the Gobi 9x35 4th generation LTE modem. It is sampling right now and there should be customers who will announce the designs on it shortly.

The SVP has also confirmed that SoC parts will soon to move to 20nm and when asked whether TSMC has capacity and is ready for mature production of 20nm his answer was positive. He actually said to expect a 20nm SoC real soon, but he didn’t get into any details.

The Cat 6 300 Mbps modem in 20nm obviously needs much less power and it will improve battery life on LTE devices. We can see this product as very interesting option for many high-end phones. Modems are easier and less complex to make compared to SoCs and this is why Qualcomm traditionally moves the LTE modem to a new processor node first. The company then follows up with a SoC that is much more complex to manufacture.

With every shrink of the processor node, power goes down significantly and this is what high-end application processors are all about. At 28nm chipmakers are already pushing the envelope with big A15-class parts and the move to 20nm can’t come soon enough.

blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments