Using new second-gen 14nm FinFET low-power plus (LPP) process
On Thursday, Samsung announced it has begun mass production of the company’s second-generation 14nm 3D FinFET low-power plus (LPP) process technology.
Greenland in 2016 claims ETNews
Korean ETNews believes that AMD will start manufacturing high-end Greenland GPUs in Samsung factories in the second quarter of 2016.
Octa core 14nm Cat 12 LTE modem
Samsung has officially unveiled its second generation FinFET processor and dubbed it Exynos 8890.
Cortex A72 with 16nm TSMC FinFET
Huawei, the company that is probably the hardest to pronounce in tech has officially unveiled its Kirin 950 first FinFET 16nm based processor.
CEO confirms spec
Troubled AMD's CEO has been attempting to rally the troops with further promises about how good things are going to be next year.
Interview: Plans are very competative to Intel
Fudzilla had a chat with Vice President Product Management at Qualcomm Vinay Ravuri and discovered how he is taking on Intel in his home turf of the server.
Server Development Platform (SDP) in the open
Earlier this year Fudzilla mentioned that Qualcomm was working on a Server Development Platform (SDP) and now the company is ready to talk about it .
FinFETs and SOI working in different environments
Soitec's CEO and board chairman has raised an eyebrow or two when he said that the iPhone 6s has multiple RF chips built on silicon-on-insulator (SOI) substrates and that Intel and IBM are using the tech for their silicon photonics push.
More Samsung in Plus and TSMC in 6S
The iPhone 6S and the Plus are made up from an equal overall part of the processors from TSMC and Samsung factories.