Lower electricity and cheaper
Samsung Electronics is introducing a third 14-nano FinFET system semiconductor process that has lower electricity consumption and production cost than previous cost.
More details may come at DAC 2016 in June
Taiwan Semiconductor Manufacturing Company is set to launch a production trial of its 7-nanometer process node in the first half of 2017, according to company chairman Morris Chang in a recent report mailed to company shareholders.
Low-end, midrange smartphone demand offset February earthquake
On Thursday Taiwan Semiconductor Manufacturing Company announced an 18 percent quarterly revenue decline for Q1 2016 from the same timeframe a year ago in Q1 2015. The chip manufacturing giant also announced Q1 2016 net profit of $2 billion USD ($64.78 billion TWD), representing an 8.3 percent quarterly profit decline from the same timeframe a year ago in Q1 2015.
IPhone 7 believed to be the target
The dark satanic rumour mill has manufactured a hell on earth yarn about TSMC ramping up production of Intel’s XMM 7360 LTE modem.
Could be used by 2018
Extreme-ultraviolet (EUV) lithography is working and could be used in Moore Law saving high-volume chip manufacturing as early as 2018.
Jen-Hsun Huang just announced Pascal P100 a new GPU based on Pascal architecture, and it is in production, shipping "soon."
$3 billion investment in 12-inch fab
TSMC is building a 12-inch fab Nanjing City Government and will write a cheque for $3 billion as part of the deal.
Low power high performance chips
ARM has teamed up with TSMC to develop a 7nm process technology to produce low-power, high-performance chips for next-generation networks and data centres.
Made using TSMC's 16nm FinFET Plus
Cadence Design Systems says its DDR4 and LPDDR4 IP using TSMC's 16nm FinFET Plus (16FF+) process have completed TSMC9000 Silicon Assessment.
Shipping values priced between $608 and $810 USD per unit
Any time a new batch of GPUs are ready to be sent from a manufacturing facility overseas to a supply partner for testing and metrics, there are always debugging and testing parts sent ahead of time to ensure that silicon is quickly brought to market without suffering silicon respin and unforeseen manufacturing delays.