The chip packs 512 EUs, for a total of 4096 shading units, and should be paired up with 16GB of GDDR6 memory.
Xe-HPG (DG2) real candy - very productive time at the Folsom lab couple of weeks ago. “From jittery journeys to buttery smooth” said @rogerdchandler -— Raja Koduri (@Rajaontheedge) June 2, 2021
lots of game and driver optimization work ahead for @gfxlisa’s software team. They are all very excited..and a little scared:) pic.twitter.com/tQcfEWf8p4
Raja Koduri, who is senior vice president, chief architect, and general manager of Architecture, Graphics, and Software at Intel Corporation, tweeted this piece of "real candy" and that there is a lot of work ahead on game and driver optimizations for the software team, led by Lisa Pearce, Vice President at Intel Corporation.
rogame user from Twitter did die size calculations comparing it to the PCB scheme leaked earlier by Igor Wallosek, showing a rough die size of 190mm².