Shuttle has introduced the new XPC Barebone XB860G2, a compact system designed to bridge the gap between mini PCs and full-sized workstations, targeting professional workloads that require both performance and a small footprint.
The XB860G2 is built on Intel’s B860 chipset with the new LGA1851 socket, supporting Core Ultra 200 series processors and up to 96 GB of DDR5-5600 memory. It also brings notable GPU expandability for its size, featuring a PCIe 5.0 x16 slot via a riser card that can accommodate dual-slot graphics cards up to 208 mm, enabling use cases such as CAD, AI inference, and edge computing.
Storage and connectivity are also a focus, with three M.2 slots (one PCIe 5.0 and two PCIe 4.0), support for up to four displays via HDMI and DisplayPort, and dual LAN networking with 2.5 GbE and 1 GbE ports. The system also includes an additional PCIe 4.0 x1 slot for further expansion when using integrated or single-slot graphics.
Despite its 4.7-liter chassis, Shuttle has designed the system for sustained workloads with optimized cooling, while maintaining flexibility for deployment across scenarios such as medical imaging, digital signage, and industrial edge setups.
The Shuttle XPC Barebone XB860G2 is available now through authorized channels and ships with a VESA mount and a 180 W external power adapter.
Specifications:
- Model series: 3rd generation of the G2 series (successor to XH510G2/XH610G2)
- Chipset: Intel B860 (LGA1851 socket for Arrow Lake-S up to 65W TDP)
- RAM: Max. 96 GB DDR5-5600 (2× SO-DIMM)
- Graphics: PCIe 5.0 x16 slot for dual-slot cards up to 208 mm
- Storage: 3× M.2 NVMe SSD slots (1× Gen 5, 2× Gen 4)
- Network: Dual LAN (2.5 GbE + 1 GbE)
- Dimensions: (W x D x H) 237 × 200 × 95 mm (approx. 4.7 litres)
