5nm process and chiplet packaging
In addition to giving us some insight into its Zen CPU future, AMD has unveiled a bit more details about its RDNA 3 graphics architecture during the Financial Analyst Day 2022, confirming that RDNA 3 will be built on 5nm manufacturing and have a chiplet packaging.
According to AMD’s David Wang, Senior Vice President of Engineering at Radeon Technologies Group, the projected performance-per-Watt uplift for its RDNA 3 architecture is over 50 percent, compared to RDNA 2 architecture. AMD further explains that the uplift is achieved through a 5nm manufacturing process, advanced chiplet packaging, rearchitected compute unit, optimized graphics pipeline, and the next-gen AMD Infinity Cache.
The new roadmap briefly mentions the RDNA 4 architecture that will be based on an “advanced node”, and probably come in 2024.
As you already know, AMD’s RDNA 3 is expected to launch later this year with Navi 3x and according to what AMD is promising, we are certainly looking forward to it.
