Qualcomm Snapdragon 810 reference hardware is out
4K tablet and phone, er, tablet with voice (more…)
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Intel’s new 3D NAND features 32 layers
256Gb (32GB) per single MLC die During its latest investor meeting, Intel revealed a few…
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Norway puts data centre power grab on hold
Norway’s grid operator has paused new data centre capacity reservations while it develops rules for…
Google adds AMD muscle to its TPU challenge
Google has unveiled two more TPU systems, pairing one with AMD processors and cramming two…
Infineon puts silicon carbide on a bigger wafer
Infineon has produced working power devices on 300mm silicon carbide wafers, using existing silicon manufacturing…
AMD driver gives idle SSDs a pointless workout
AMD has acknowledged a Radeon software bug that keeps writing to SSDs while affected PCs…
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