China’s largest memory maker CXMT is expanding its high-bandwidth memory ambitions, with reports saying it plans to convert a sizeable chunk of its DRAM output to HBM3.
Korean outlet MK reports that CXMT intends to allocate 20 per cent of total production to HBM3, or about 60,000 wafers, as it seeks to enter the AI supply chain.
That puts the idea that Chinese DRAM suppliers will ‘somehow’ rescue gamers from memory shortages in a slightly different light, since capacity is being steered towards pricier AI kit.
Demand for HBM is said to be surging inside China’s AI market, particularly as the region is cut off from easier access to supply from Korean memory manufacturers.
The report claims HBM is a key bottleneck for Huawei’s efforts to scale AI chip production, noting that the company previously relied on stockpiled supply from Samsung gathered before export controls tightened.
CXMT’s HBM3 is not yet in mainstream markets, and the key issue is yield, since the company lacks EUV and must rely on multi-patterning.
Even so, if CXMT lands a workable HBM3 process, it would count as a meaningful breakthrough for China’s HBM industry and could help Huawei scale its Ascend chip output.
CXMT is also reportedly in discussions with global PC manufacturers, with talks still at the validation stage as buyers assess its DRAM capacity.
If CXMT gets HBM production moving properly, more DRAM lines could be diverted, and the dream of buying Chinese memory at ‘cheap’ prices starts looking a bit shaky.
