Updated: Now with photos, maple syrup
Today we had a
chance to visit Globalfoundries Fab 1 in Dresden, Germany and we saw 32nm 300mm
wafers in a test production run of some core logic as well as some memory.
The process won't be ready for customers before mid
2010, but since AMD is the only one that will be needing 32nm silicon on
insulator, the schedule is ahead of time, as AMD won't have any 32nm
products before 2011.
This schedule is part of AMDs design process and has
nothing to do with the Fab, but it is too early to talk about the state of the
process and yields. The 32nm transition will be a tough one. Despite the fact
that transistors and transistor pitch are getting smaller, AMD also needs to
implement high metal gate, and as far as we understood, this is not a walk in
the park.
Nick Ernst from Golem.de
Scott Bicheno from Hexus, Fudo in the middle and Jason Gorss PR manager of Globalfoundries.
Jon Carvill Director of Globalfoundries, Fudo, Scott Bicheno and Paul Dutton of Hexus
