The dark satanic rumour mill has manufactured a hell-on-earth yarn claiming that Intel is lining up Nova Lake desktop CPUs with 900-series chipset boards on the LGA 1954 socket.
That lot will replace Arrow Lake desktop chips, which sit on 800-series boards using the LGA 1851 socket.
Leaks claim Nova Lake-S will come in two flavours, a single compute tile part with up to 28 cores and a dual compute tile monster with up to 52 cores.
The chips are also tipped to be first in line for Troubled Chipzilla’s big bLLC cache designs, with up to 144MB on single-tile parts and 288MB on dual-tile models.
According to Kopite7kimi, the top Nova Lake-K with dual compute tiles could pull more than 700W at full load, which is firmly in daft territory for a desktop.
For comparison, the flagship Arrow Lake Core Ultra 9 285K can hit around 370W to 400W when fully unlocked under stress tests, which is already plenty spicy.
The logic is that doubling cores and piling on cache will push power up, but Kopite7kimi reckons these dual-tile parts should be treated like HEDT, not mainstream.
Jaykihn also dropped early TJMax details, suggesting the thermal sensor can report from -64°C to 100 °C with Negative Temperature Reporting enabled.
The TJMax cannot be offset, and thermal throttling cannot be disabled, which means chips will run hotter while decent cooling gets a proper workout.
Package size is said to match Arrow Lake, so existing coolers should fit, though new IHS offsets might be needed to stop the contact patch from being a mess.
Each 8+16 compute tile is pegged at roughly 94 mm², so two would occupy around 190 mm² of the package, with 4 MB of L2 cache per Coyote Cove P-core cluster.
Chipzilla is expected to launch Nova Lake-S and 900-series boards later this year, aligning a second-half 2026 scrap with AMD’s Zen 6 Ryzen parts.
