Intel has started stuffing its Panther Lake silicon into passport-sized boards for edge AI and embedded kits.
At Intel Tech Tour 2025 the outfit showed off its Panther Lake modules, and now congatec has rolled out COM-HPC and COM Express variants built around Intel Core Ultra Series 3 parts.
The new modules support Panther Lake-H CPUs with up to 16 cores, topping out at the X9 388H, and are specced around a 25W baseline TDP.
Memory configurations are where things get interesting, particularly for compact edge systems that still want to flex some AI muscle.
Two modules ship with onboard LPDDR5X, with the conga-MC1000 offering up to 32GB at 8533 MT/s, while the larger conga-HPC goes up to 96GB at the same speed.
There are also two LPCAMM2 options supporting up to 96GB of LPDDR5X running between 7466 and 8533 MT/s.
For those who still prefer a memory socket, a SO-DIMM variant provides two slots for up to 128GB of DDR5 at speeds up to 7200 MT/s.
The Panther Lake Core Ultra Series 3 modules can deliver up to 12 Xe3 GPU cores and up to 120 TOPS of AI performance, with 50 TOPS from the NPU alone.
That makes these boards less about spreadsheets and more about on-device inferencing at the edge. The modules can independently drive three to four 6K displays and are rated to operate between 40 °C and 85 °C.
Each comes with a 10-plus-year availability promise, which is the sort of lifecycle industrial customers expect, and laptop buyers rarely get.
While 25W is the standard TDP, integrators can configure power between 15W and 65W depending on thermal headroom and performance needs.
Form factors include COM Express Type 10 at 84mm by 55mm, COM-HPC Mini at 95mm by 70mm, COM Express Compact at 95mm by 95mm, and COM-HPC Client Size A at 95mm by 120mm.
For edge AI deployments where space is tight but inference workloads are not, Chipzilla clearly wants Panther Lake to be the silicon of choice.
