Reduces footprint, boosts efficiency
Samsung has announced that it is now mass producing Embedded Package on Package (ePoP) memory, which greatly increases density and efficiency.
A single ePoP module includes 3GB of LPDDR3 DRAM and 32GB of eMMC storage, along with a controller. The module is thin (1.4mm) and small, with a significantly smaller PCB footprint than current two-package eMCP memory solutions.
Samsung’s new ePoP takes up 225 square millimetres (15x15mm), just like the mobile application processor. The currently used PoP also measures 15mm x 15mm, but it consists of the mobile processor and DRAM – eMMC is housed in a separate 11.5mm x 13mm package, so the whole platform takes up 374.5 square millimetres. Samsung said ePoP decreases the total area used by approximately 40 percent.
“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” said Jeeho Baek, senior vice president of Memory Marketing at Samsung Electronics.
Baek said Samsung plans to expand its line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, with a focus on the high-end market.
However, a similar approach can be used in a wide range of mobile devices. Samsung already offers a single-package solution for wearables (like the Apple S1 module). The technology could also be used in tablets and other devices.
Images via Samsung Tomorrow blog
