Chipzilla gets Google packaging sniff
Intel’s EMIB-T packaging appears to be getting more attention as TSMC’s AI packaging queue comes…
cowos
AMD tries to jump Nvidia in Taiwan
AMD chair and chief executive Lisa Su has flown into Taiwan early to fight for…
Amkor reckons glass substrates are nearly ready
Amkor says glass substrates, the CoWoS alternative Intel has been pushing, should see its first…
TSMC stretches EUV
TSMC is squeezing the old EUV lemon instead of buying ASML’s priciest juicer. At TSMC’s…
SMIC hunting for packaging magic
China’s biggest foundry, SMIC, wants tighter ties with the testing crowd, hoping backend tricks can…
Intel close to scoring a packaging deal with Apple
CoWoS shortages open the door for Chipzilla’s EMIB The dark satanic rumour mill has manufactured…
TSMC’s CoWoS backlog sparks outsourcing scramble
Taiwan giant turns to local partners as packaging crunch bites TSMC is stuffed to the…
AI chip boom leaves TSMC scrambling to meet demand
Taiwanese foundry forced to plan packaging a year in advance TSMC is finding itself on…
TSMC muscles into silicon photonics, leaving Intel gasping
A patent surge, Nvidia’s shove, and a 2026 CPO rollout crank up the pressure. TSMC…
TSMC to bring chip packaging tech to US
Taiwanese outfit bets big on CoWoS, SoIC, and CoW fab in Arizona TSMC is plotting…