South Korea's Hynix claims to have developed the world's highest-density memory chip using the thinnest process technology.

According to the press release the new Hynix "DDR3 DRAM uses technology that allows circuits inside to be just 40 nanometres apart which is about a fifth thinner.

While the chip is 50 percent more productive than existing chips as it requires less energy and costs less to produce. Mass production begins in the third quarter of this year and will be coming out into a chip market hard hit by the global economic downturn.