ASML reckons Elon Musk’s Terafab wheeze could need chipmaking capacity on the scale of Korea’s monster DRAM plants.
ASML chief executive Christophe Fouquet told Bloomberg that Musk’s Terafab project was an example of a major fabrication-plant scheme, and that ASML was watching the project closely to ensure it could meet demand when orders start turning up.
“The TeraFab is an example of a major fab project. If you look at some of the DRAM projects in Korea, you also look at a million-wafer fab, so that’s also pretty big.”
The comment suggests Musk’s chip ambitions are not just another PowerPoint moonshot, although with Musk, there is usually a rocket-shaped caveat attached.
Fouquet was asked whether AI data centres in space could create another boost for ASML.
He said the space data-centre idea was less about total capacity and more about solving the ugly energy problem facing conventional data centres.
“So, maybe not too much to do with the total data centre capacity, but maybe more about trying to solve another potential big issue, which is energy for data centres,” he said.
Fouquet thinks the AI semiconductor cycle is still in its early stages, which is handy if your firm sells the kit needed to make advanced chips.
He said AI companies were loud about chip demand last year, but the semiconductor industry was slow to respond.
According to Fouquet, the industry only started reacting properly near the end of last year, meaning chipmakers now need more capacity and ASML must supply the gear.
“And the catch-up will take quite a bit – and that’s only for the infrastructure, and then the applications will come,” Fouquet said.
Fouquet was less cheerful about Europe, saying the US buys 80 per cent of all advanced chips made globally and is backing champions across the AI semiconductor ecosystem.
Europe, by contrast, is “possibly quite behind compared to what is happening today,” which is polite executive code for missing the bus while arguing about the timetable.
