The dark satanic rumour mill has manufactured a hell-on-earth yarn claiming that Intel is considering a tuned-up 14A node as TSMC and Samsung sharpen their 1.4nm foundry knives.
Intel’s process technology roadmap is expected to gain an optimised version of its 14A node. The newer version is tipped to use a dual-sided architecture as the foundry fight gets nastier.
TSMC and Samsung are warming up the foundry market with 1.4nm offerings due in the coming years. TSMC is bringing its A14 fabs online next year, while Samsung is targeting 2029 for mass production of its 1.4nm technology.
Intel is set to launch its 14A technology in the coming year. External customers are lining up to see whether Chipzilla’s revived foundry and manufacturing business is more than a glossy roadmap.
According to ET News, Intel is considering updates to its process technology roadmap. The changes are mainly aimed at the coming scrap with TSMC and Samsung.
Among the node updates is a new addition called 14A2. The technology is expected to be a refinement of the standard 14A process.
Intel 14A uses PowerDirect, adding back-side power delivery networks. The 14A2 node is expected to feature a dual-sided architecture, using power delivery from both the front and back sides.
The M0 pitch for the base 14A node will be reduced to 28nm. The 14A2 process will reportedly cut the pitch further to 21nm, which sounds impressive until the physics bill arrives.
“According to industry sources, Intel had planned to apply ‘PowerDirect,’ a technology dedicated to Back Power Delivery Networks (BSPDN), to its base 1.4nm process, 14A; however, it is reportedly considering the introduction of a ‘Dual Side’ architecture that utilizes both front and back power for the subsequent 14A2 process,” ETNews reported.
The move will be helped by improvements such as double patterning, which brings density gains. Intel 14A is already expected to deliver a 30 per cent uplift in transistor density, so 14A2 should push things further.
That could improve use of High-NA EUV kit and make each machine more profitable. The 21nm pitch size brings headaches, though, including increased resistance.
The nTSVs, or nano through-silicon vias, are not designed to handle those higher densities. Chipzilla is said to have adopted a composite structure using BSPDN as the main power source, with part of the job shifted to front-side metal.
Semiconductor firms are throwing everything at manufacturing as compute and AI demand keeps climbing. With TSMC loaded with orders, chipmakers are eyeing other foundries, including Intel and Samsung.
Chipzilla is riding a fresh wave of confidence, but it still has plenty to prove in semiconductor manufacturing. External customers will be watching 18A-P, 14A and now 14A2 to see whether the comeback story has any silicon under it.
