JEDEC Solid State Association has released a new preview for the next version of the LPDDR6 standard, including a few updates that will bring improvements to the standard itself, extend density, and eventually introduce a new LPDDR6 SOCAMM2 module standard, all to extend the LPDDR6 standard from mobile platforms to data centers and such.
In short, planned features include a narrower per-die interface (x6), moving from x16 to x24 interface width, with the inclusion of x12 and an additional x6 sub-channel mode, allowing more die per package and higher memory capacities per component and per channel. It will also bring flexible metadata carve-out, which should minimize impact to peak data throughput, allowing data center customers to balance user capacity and metadata needs according to the requirements.
The future update to the JEDEC LPDDR6 standard also includes 512GB density, pushing LPDDR6 beyond the current LPDDR5/5X maximum, and the development of the LPDDR6 SOCAMM2 module standard, giving a compact, serviceable module form factor that should be a direct upgrade from LPDDR5X SOCAMM2 modules.
JEDEC is also developing LPDDR6 (Processing-in-Memory) PIM standard, which should integrate processing capability directly into LPDDR6 memory, addressing increased performance and energy-efficiency requirements for edge and data center inference workloads.
“Stay tuned for more details on the next version of LPDDR6 as well as LPDDR6 PIM and LPDDR6 SOCAMM2,” said Mian Quddus, JEDEC Board of Directors Chairman. “The subcommittee continues to evaluate features for inclusion in these standards when they are published.”
