Nvidia is reportedly investigating glass substrates for its next-generation AI processors, with the technology potentially entering production as early as 2028.
According to Taiwan’s Commercial Times, the GPU maker is talking to semiconductor suppliers about replacing conventional organic substrates with glass in advanced chip packaging. German equipment manufacturer SCHMID is reportedly among the companies involved in developing the technology.
The interest comes as AI accelerators grow increasingly complicated, combining massive GPUs with multiple stacks of high-bandwidth memory. Conventional packaging materials are approaching their limits in size, dimensional stability, and heat-related deformation.
Glass offers greater flatness, better dimensional stability and favourable electrical characteristics, potentially allowing manufacturers to accommodate larger chip packages with more densely packed components. Its lower signal losses could prove particularly useful as data transfer speeds continue climbing.
Other reports from South Korea suggest Nvidia has asked substrate manufacturers in Taiwan, Japan and South Korea to complete development within two years. The company could begin adopting glass substrates before 2028, although this remains a reported target rather than a confirmed production schedule.
Nvidia chief executive Jensen Huang reportedly discussed next-generation semiconductor technologies, including glass substrates, with SK Group chairman Chey Tae-won. The talks underline growing interest in packaging technologies that can support increasingly demanding AI hardware.
Taiwanese display manufacturer AUO is positioning itself for the emerging market by exploiting its experience in large-format glass processing, precision metallisation and redistribution layers. The company is developing pilot production lines for through-glass vias, redistribution layers and glass-core substrates.
AUO chairman Paul Peng said in July that the projects were included in the company’s NT$8.6 billion capital expenditure programme. However, he indicated that glass-core technology could need another two to three years to reach greater technical maturity.
At SEMICON Taiwan 2026, AUO and Corning demonstrated a 510 × 515mm glass-core substrate combining Corning’s semiconductor-grade glass with AUO’s redistribution-layer technology. The platform targets high-density interconnects and low-loss signal transmission for larger AI server processors.
Fellow Taiwanese display maker Innolux is developing through-glass via technology and working with customers on product validation. Its panel-level packaging development uses a 620 × 670mm format designed to support multilayer redistribution layers and advanced packaging architectures.
Other companies are attempting to grab a slice of the business. Glass processor GTOC is developing thermal forming technology for substrate applications, while TPK-KY started operating a pilot line in Zhongli in early September after roughly two years of research into through-glass vias.
However, glass substrates still face significant manufacturing obstacles, including process yields, via metallisation and customer qualification. The companies involved will need to demonstrate that the technology can be produced reliably at scale before Nvidia can put it into commercial AI accelerators.
