NewsMay 6, 2026Samsung joins the trillion-dollar chip clubSamsung Electronics has ridden the AI chip frenzy to a $1tn valuation, joining TSMC in…
NewsPC HardwareApril 29, 2026Amkor reckons glass substrates are nearly readyAmkor says glass substrates, the CoWoS alternative Intel has been pushing, should see its first…
MobilesNewsApril 21, 2026Qualcomm flirts with Samsung for 2nm Snapdragon comebackQualcomm is snuffling around Samsung again for its next flagship Snapdragon. The chip outfit has…
Data CenterNewsApril 20, 2026Google eyes Marvell for TPU sidekicksGoogle is sniffing around Marvell for yet more silicon. Talks between Google and Marvell have…
AIData CenterMarch 16, 2026Nvidia unveils more details about future Feynman AI chips, including 3D die-stackingNvidia has shared fresh details about its upcoming AI data‑center platform, Rosa Feynman, confirming that…
AIData CenterGraphicsNewsPC HardwareMarch 16, 2026DRAM barons refusing to increase supplySuppliers like Samsung and SK Hynix are taking a ‘cautious’ approach to their DRAM expansion…
AIData CenterNewsMarch 12, 2026Meta doubles down on MTIA ASICs for inferenceMeta is not binning its custom silicon plans any time soon and has effectively “doubled…
GraphicsNewsPC HardwareMarch 12, 2026Lisa Su heads down memory laneAMD chief executive Lisa Su is flying to South Korea to meet with executives and…
NewsPC HardwareFebruary 17, 2026Micron spends $200bn trying to break the AI memory bottleneckMicron Technology is the biggest US maker of memory chips, and it is sprinting to…
NewsPC HardwareFebruary 13, 2026Samsung starts mass production of HBM4, shipping first commercial products to customersSamsung has announced it has started mass production of its HBM4 and has sshipped first…