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Apple eyes life beyond TSMC

The Fruity Cargo Cult Apple is snuffling around Intel and Samsung as TSMC’s success starts squeezing its favourite customers.

TSMC has become the world’s preferred chip foundry, but AI customers are elbowing into the queue and killing off Job’s Mob’s power to negotiate.

In its frustration, Job’s Mob is reportedly exploring whether to split its silicon work between Samsung, Intel and TSMC.

That would mark a shift from remaining largely dependent on TSMC, which has been the safe pair of hands for its custom chips.

According to Bloomberg reporter Mark Gurman, Apple has already held “early-stage talks” with Intel about using its chipmaking services.

At the same time, several Job’s Mob executives have visited Samsung’s under-construction Texas fab to poke around its potential for Apple silicon.

The important bit is that Job’s Mob is looking at options for the “main processors of its devices”, not just low-volume chips in niche gear.

In recent months, GF Securities and DigiTimes have reported that Job’s Mob might use Chipzilla’s 18A-P process.

That would reportedly apply to its lowest-end M-series chips due in 2027, as well as non-Pro iPhone chips in 2028.

GF Securities went further, saying Job’s Mob’s bespoke ASIC, expected in 2027 or 2028, will use Chipzilla’s EMIB packaging.

Job’s Mob has reportedly signed an NDA with Intel and obtained PDK samples of the advanced 18A-P process for evaluation.

Chipzilla’s 18A-P process is its first node to support Foveros Direct 3D hybrid bonding. That allows several chiplets to be stacked through TSVs.

Even so, Job’s Mob now appears to be looking beyond one-off, product-based chip fabrication deals.

During its latest earnings call last week, Job’s Mob admitted Mac Studio and Mac mini supply would take several months to catch up with demand.

Job’s Mob said Mac-related supply constraints were not caused by a shortage of memory, which has been tiggering the rest of the PC industry. Instead, the issue was caused by the limited availability of advanced nodes at TSMC.

The squeeze has become severe enough that Job’s Mob has pulled the base Mac mini from its configurator. That model had an M4 chip, 16GB of RAM, 256GB of storage and a $599 retail price.

The Mac Studio with 512GB of storage has also been removed, giving buyers fewer choices and Apple fewer awkward delivery promises.

TSMC is trying to expand its 3nm capacity by repurposing some 4nm lines. Those lines are now emptier because demand for low-end and mid-tier smartphone system-on-chips has weakened.

The shift should add 25,000 wafers per month in extra capacity, but that does not appear enough to clear the blockage.

AI hyperscalers are willing to pay premiums of between 50 and 100 per cent for rush orders, which tends to focus a foundry’s mind.

According to TrendForce, TSMC is adding only around 3,000 wafers per month of new 3nm capacity. It is adding 55,000 wafers per month of new 2nm capacity, showing that its attention has already shifted to the next node.

Job’s Mob has reportedly reserved around half of TSMC’s 2nm lines. Its 2nm-based products are not expected to launch until well into the second half of 2026.

That leaves Apple needing more 3nm capacity now to keep its product lines moving.

 

 

TOPICS:
2nm  ·  3nm  ·  AI hyperscalers  ·  Apple  ·  Apple silicon  ·  foundry capacity  ·  Intel  ·  Samsung  ·  TSMC

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