Published in IoT

Qualcomm & TDK team up on wireless compontents

by on13 January 2016


Spending $3 billion

Chipmaker Qualcomm and TDK have formed a $3 billion joint venture to supply key components and modules used to communicate wirelessly with devices like smartphones, drones, robots and Internet of things.

Qualcomm  will hold 51 percent of the new venture which will have the catchy title RF360 Holdings. The remaining 49 percent will be owned by EPCOS which is a subsidiary of TDK.

As part of the deal, module design and manufacturing assets, plus related patents will come from TDK and its subsidiaries, which will be bought by RF360 Holdings and Qualcomm's subsidiaries.

The companies said the new venture will also deepen the partnership between the two companies around key technology fields, including sensors and wireless charging which are all part of the coming Internet of Stuff concept which we are assured by the industry will be the next big thing.  Although we have been hearing about the Internet fridge ever since the Internet happened and it still has not arrived.

Last modified on 13 January 2016
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