The Taiwan based foundry and Qualcomm are expected to ship in volume in early 2019 with announcement of the new product in late 2018, no surprises there. This will be the chip that comes after the soon to be announced Snapdragon 845.
The most talked phone after iPhone, the Samsung Galaxy S9, is the first chip to feature the Snapdragon 845 but Samsung will use its own 10nm Exynos 8910 for some markets too. Luckily for Qualcomm no one else will use Exynos, as the majority of the Android high end phones exclusively use the Snapdragon 800 series chips.
Samsung is of course expected to manufacture its chips at its own fabs and we would expect this to happen in 2019 and volume production with some risk production in late 2018. This is the SoC that comes after Exynos 8910 and if all goes well, it will first ship in the 2019 Galaxy S phone.
Qualcomm and Broadcom, according to the report are designing their next generation chips with TSMC’s7-nano PDK. The reason why Qualcomm went with 7nm with TSMC is the fact that the fab uses normal steppers while Samsung wants to make its 7nm with more bold and riskier EUV (Extreme Ultraviolet) photolithography technology.
Samsung is expected to be later to the 7nm game and early adopters had to go with TSMC. EUV is still technology that is not entirely ready for the mass market and there is a disagreement weather you should need to use Extreme Ultraviolet light manufacturing with 7nm or first with 5nm. Obviously the two main fabs disagree while GlobalFoundries cooperates and shares technology with Samsung, and will have Samsung to rely upon for 7nm.