Published in Mobiles

MediaTek announces 4nm Dimensity 8300 SoC

by on21 November 2023

Significantly faster thanks to Armv9 CPU cores and Mali-G615 GPU

MediaTek has announced its newest Dimensity 8000-series SoC, the Dimensity 8300. The new SoC is both faster and much more efficient thanks to the fact it is manufactured on TMSC's 4nm manufacturing process and comes with Armv9 CPU cores and the new Mali-G615 GPU.

The CPU part of the Dimensity 8300 SoC features a single Cortex-A715 Prime core, clocked at 3.35GHz, three Big (or Performance) Cortex-A715 cores clocked at 3.0GHz, and four Little (or Efficiency) Cortex-A510 cores clocked at 2.2GHz. According to MediaTek, the new SoC is up to 20 percent faster and up to 30 percent more efficient compared to the Dimensity 8200 predecessor.

The GPU is the Mali-G615, which is said to be up to 60 percent faster and up to 55 percent more power efficient compared to the predecessor. MediaTek also equipped it with a new APU 780, which should speed up AI tasks, and the new Imagiq 980 ISP that gets 320MP camera support and 4K video recording at 60 fps. The new SoC also gets quad-channel LPDDR5X-8533 RAM support and UFS 4.0 storage support.

As expected, it has a 5G modem with dual-mode 5G and up to 5.17Gbps download, as well as WiFi 6E and Bluetooth 5.4 connectivity.

MediaTek has announced that the new SoC will be launching in the global market before the end of this year, and Xiaomi is one of the first smartphone makers to implement it in its Redmi K70E smartphone.

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